Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM

This is a Thickened Thermal Conductive Silica Gel Pad. The pad is used for good thermal conductivity between IC and heatsink. With the characteristics of softness and elasticity, the thermal pads can cover very incomplete surfaces. Heat can be conducted from the internal device to the metal shell or the heat sink plate Improve the efficiency and service life of heating electronic components.

Package Includes:

1 x Thickened Thermal Conductive Silica Gel Pad