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Thickened Thermal Conductive Silica Gel Pad Size: 10x10x6MM


  1. Product: Thermal Conductive Silica Gel Pad
  2. Product type: Thermal Insulator Gel pad
  3. Operating Temperature: -40 ℃ – 200 ℃ will not melt
  4. Color: Color of Actual Product Can  vary from given Image
  5.  Size: 10x10x6MM

85.00 145.00

This is a Thickened Thermal Conductive Silica Gel Pad. The pad is used for good thermal conductivity between IC and heatsink. With the characteristics of softness and elasticity, the thermal pads can cover very incomplete surfaces. Heat can be conducted from the internal device to the metal shell or the heat sink plate Improve the efficiency and service life of heating electronic components.


Package Includes:

1 x Thickened Thermal Conductive Silica Gel Pad

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